METHOD FOR ACHIEVING ELECTROMAGNETIC PROTECTION OF ELECTRONIC CIRCUITS USING METAL-COATED PLASTIC CASES

The invention relates to a method of electromagnetic protection of electronic circuits using metal-coated plastic cases. According to the invention, the method consists in coating the case walls with conductive layers, as follows: an at least 600 nm-thick Cu layer and an at least 400 nm-thick Ni layer, said layers having the role of reflecting and absorbing the electromagnetic radiation, the thermionic vacuum arc method being used for deposition.